IEC 62047-35:2019 pdf download

IEC 62047-35:2019 pdf download.Semiconductor devices – Micro-electromechanical devices – Part 35: Test method of electrical characteristics under bending deformation for flexible electromechanical devices
1 Scope
This part of IEC 62047 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 1 0 µm to 1 mm, but these are not limiting values. The test method is so designed as to bend devices in a quasi-static manner monotonically up to the maximum possible curvature, i.e. until the device is completely folded, so that the entire degradation behaviour of the electric property under bending deformation is obtained. This document is essential to estimate the safety margin under a certain bending deformation and indispensable for reliable design of the product employing these devices.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: • IEC Electropedia: available at http://www.electropedia.org/ • ISO Online browsing platform: available at http://www.iso.org/obp 3.1 General 3.1.1 flexible micro-electromechanical system flexible MEMS device with structured semiconductor and/or mechanical components electrically connected to each other, being assembled onto or embedded into flexible substrate and operated without unacceptable loss of its functions under bending deformation EXAMPLE Organic transistors, thermistors, smart diapers with wet sensors and smart epidermal patches for health care, etc. Note 1 to entry: This note applies to the French language only. 3.2 Loading configurations 3.2.1 bending axis line on a device around which the device is bent with the minimum radius of curvature Note 1 to entry: Due to the characteristics of this document, the bending axis can be and should be placed at arbitrary positions in arbitrary directions in accordance with the requirements of the evaluation. The actual positions and directions shall be intentionally determined according to the structures on the test piece.
4 Test piece
4.1 General A flexible MEMS device, which is bent in use, can in principle be a test piece as it is and subjected to the evaluation of this document. In principle, this test method is applicable without restriction as to the size and shape of the devices. However, for ease of a load application, it may be cut into a rectangular shape with target parts to be loaded at the center as mentioned in 4.2. More methods for test piece preparation are suggested in Annex B. 4.2 Shape of a test piece A rectangular shape of the test piece should be used for the ease of experiment as shown in Figure 1 . It may be necessary to cut out a part of the devices for the test, especially when the target part to be tested, which determines its own functional feature, is not located in the center of the device. In this case, the test piece shall be prepared in a rectangular form by cutting a part out of the entire device with the target part located at the center of two parallel edges which should also be parallel to the bending axis. This is because the point to be loaded to the end is limited in this test method only along the bending axis likely coming out at the center due to the loading scheme explained in 5.1 . In this document, the length l and the width w of test piece are the dimensions of the test piece in the perpendicular and parallel direction to the bending axis, respectively. Because of the structures assembled on or embedded in the flexible substrate, the thickness may not be uniform over the entire device and hence depends on the location.