IEC 60749-30:2020 pdf download

IEC 60749-30:2020 pdf download.Semiconductor devices – Mechanical and climatic test methods
1 Scope
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore, the temperature at the top of the package on the hottest moisture sensitive SMD during assembly is monitored to ensure that it does not exceed the temperature at which the components are evaluated. NOTE 2 For the purpose of this document, SMD is restricted to include only plastic-encapsulated SMDs and other packages made with moisture-permeable materials.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-4, Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp heat, steady state, highly accelerated stress test (HAST) IEC 60749-5, Semiconductor devices – Mechanical and climatic test methods – Part 5: Steady-state temperature humidity bias life test IEC 60749-11, Semiconductor devices – Mechanical and climatic test methods – Part 11: Rapid change of temperature – Two-fluid-bath method IEC 60749-20:2020, Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effects of moisture and soldering heat IEC 60749-24, Semiconductor devices – Mechanical and climatic test methods – Part 24: Accelerated moisture resistance – Unbiased HAST IEC 60749-25:2003, Semiconductor devices – Mechanical and climatic test methods – Part 25: Temperature cycling IEC 60749-33, Semiconductor devices – Mechanical and climatic test methods – Part 33: Accelerated moisture resistance – Unbiased autoclave.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: IEC Electropedia: available at http://www.electropedia.org/ ISO Online browsing platform: available at http://www.iso.org/obp 3.1 dead-bug orientation orientation of a package with the terminals facing upwards 3.2 floor life allowable time period after removal of moisture-sensitive devices from a moisture-barrier bag or dry bake and before the solder reflow process 3.3 live-bug orientation orientation of a package when resting on its terminals 3.4 moisture-sensitivity level MSL rating indicating a device’s susceptibility to damage due to absorbed moisture when subjected to reflow soldering 3.5 process sensitivity level PSL rating used to identify a component that is solder process sensitive and which cannot be used in one or more of the base solder process conditions 3.6 solder reflow solder attachment process in which previously applied solder or solder paste is melted to attach a device to a printed circuit board
4 General description
Package cracking and electrical failure in plastic encapsulated SMDs can result when soldering heat raises the vapour pressure of moisture which has been absorbed into SMDs during storage. In this test method, such problems are assessed and SMDs are evaluated for heat resistance after being soaked in an environment which simulates moisture being absorbed while under storage in a warehouse or dry pack.