IEC 62149-11:2020 pdf download

IEC 62149-11:2020 pdf download.Fibre optic active components and devices – Performance standards
1 Scope
This part of IEC 62149 specifies the performance standards for a multiple channel transmitter/receiver chip scale package (CSP) with multimode fibre interface that operates at up to 28 Gbit/s per channel. It specifies the parameters that apply, with clearly defined conditions, severities, and pass/fail criteria. The tests are intended to be run as an initial design verification to prove any product’s ability to satisfy the performance standard’s requirements.
A product that has been shown to meet all the requirements of a performance standard can be declared as complying with the performance standard, but is then controlled by a quality assurance/quality conformance program.
2 Normative references
There are no normative references in this document.
3 Terms and definitions, abbreviated terms and symbols
For the purposes of this document, the following terms, definitions and abbreviated terms apply.
ISO and IEC maintain terminological databases for use in standardization at the following addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Product parameters
4.1 Diagram The chip scale package is constructed with a silicon photonics platform. Alternatives of 4ch transceiver (transmitter and receiver), 12ch transmitter, and 12ch receiver are specified. The block diagram for the 4ch transceiver is shown in Figure 1; the 12ch transmitter is shown in Figure 2, and the 12ch receiver is shown in Figure 3. The transmitter and receiver do not contain CDR functions, so the external CDR functions shall be provided as separate chips when needed. The terminal definitions for all alternatives are summarized in Table 1. The definitions for “p” and “n” for electrical signal inputs and outputs are “non-inverted” and “inverted” respectively.
The transmitter/receiver chip scale package has a free-space optical interface. The optical coupling scheme to multimode fibre (A1-OMx series: IEC 60793-2-10) is shown in Figure A.1, and the optical coupling scheme to polymer waveguide is shown in Figure A.2. The chip scale package using a silicon photonics platform uses grating couplers to couple the output beam. The grating coupler produces a tilted beam output, typically at 8 °. The output beam from the grating coupler is guided by an optical guiding structure to the surface of the package. The optical reference plane is defined at the top surface of the package. Proper structure to place the MMF with an angled facet of 8° is recommended.